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List:       openmoko-commitlog
Subject:    commitlog Digest, Vol 869, Issue 2
From:       commitlog-request () lists ! openmoko ! org
Date:       2009-09-08 9:56:07
Message-ID: mailman.0.1252404002.24203.commitlog () lists ! openmoko ! org
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Today's Topics:

   1. r5616 - trunk/gta02-core/modules (rehar@docs.openmoko.org)

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From: rehar@docs.openmoko.org
Precedence: list
To: commitlog@lists.openmoko.org
Date: Tue, 08 Sep 2009 07:59:28 +0200
Message-ID: <E1Mktjk-0001SS-Go@docs.openmoko.com>
Content-Type: text/plain; charset=UTF-8
Subject: r5616 - trunk/gta02-core/modules
Message: 1

Author: rehar
Date: 2009-09-08 07:59:27 +0200 (Tue, 08 Sep 2009)
New Revision: 5616

Modified:
   trunk/gta02-core/modules/wm8753fl.fpd
Log:
wm8753fl.fpd
- added solder paste layer for thermal land

Modified: trunk/gta02-core/modules/wm8753fl.fpd
===================================================================
--- trunk/gta02-core/modules/wm8753fl.fpd	2009-09-08 03:37:59 UTC (rev 5615)
+++ trunk/gta02-core/modules/wm8753fl.fpd	2009-09-08 05:59:27 UTC (rev 5616)
@@ -4,10 +4,23 @@
 
 	ur: vec @(D2/2,E2/2)
 	ll: vec @(-D2/2,-E2/2)
-	pad "GND" ur ll
+	pad "GND" ur ll bare
 
 }
 
+frame solder_paste {
+	set count = paste_array
+	set space_x = D2/(4*count)
+	set width_x = (D2-(space_x*(count+1)))/count
+	set space_y = E2/(4*count)
+	set width_y = (E2-(space_y*(count+1)))/count	
+	loop x=1,count
+	loop y=1,count
+	ur: vec @(-D2/2+x*space_x+(x-1)*width_x,E2/2-y*space_y-(y-1)*width_y)
+	ll: vec @(-D2/2+x*(space_x+width_x),E2/2-y*(space_y+width_y))
+	pad "paste" ur ll paste
+
+}
 frame outline {
 	set diam = 0.7mm
 	ll: vec @(-D/2-silk/2,-E/2-silk/2)
@@ -26,7 +39,7 @@
 frame pad_x {
 
 	ur: vec @(b/2,0mm)
-	ll: vec @(-b/2,-L-A3)
+	ll: vec @(-b/2,-L-l)
 	pad "$name" ur ll
 
 }
@@ -34,7 +47,7 @@
 frame pad_y {
 
 	ur: vec @(0mm,b/2)
-	ll: vec @(-L-A3,-b/2)
+	ll: vec @(-L-l,-b/2)
 	pad "$name" ur ll
 
 }
@@ -78,10 +91,10 @@
 }
 frame pads{
 	set pin = 0
-	u: vec @(-e*(xpads-1)/2,E/2+A3)
+	u: vec @(-e*(xpads-1)/2,E/2+l)
 	b: vec @(-e*(xpads-1)/2,-E/2+L)
 	l: vec @(-D/2+L,-e*(ypads-1)/2)
-	r: vec @(D/2+A3,-e*(ypads-1)/2)
+	r: vec @(D/2+l,-e*(ypads-1)/2)
 	frame pads_u u
 	frame pads_b b
 	frame pads_l l
@@ -89,7 +102,6 @@
 }
 package "WM8753FL"
 
-set A3 = 0.2mm
 set D = 7mm
 set E = 7mm
 set D2 = 5.15mm
@@ -99,10 +111,18 @@
 set L = 0.4mm
 set xpads = 12
 set ypads = 12
+
+/*pad exposure length*/
+set l = 0.2mm
+
+/*array size for thermal land solder paste layer 4 = 4x4*/
+set paste_array = 4
+
 set silk = 0.1mm
 
 frame outline @
 frame pad_gnd @
+frame solder_paste @
 frame pads @
 
 /*chip outline dimensions / inner edge of silk screen*/
@@ -118,7 +138,7 @@
 
 measx outll -> outlr -1.5mm
 measy outlr <- outur 1.5mm 
-measy pad_y.ll -> pad_y.ur 1mm-A3
+measy pad_y.ll -> pad_y.ur 1mm-l
 measy pad_x.ll -> outll 1mm+((E-e*(xpads-1)-b)/2) 
 measy outll -> pad_x.ur 1mm
 measy pad_gnd.ur -> pad_gnd.ll -((E+E2)/2)-1mm




--===============1247528179==--

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