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List:       linux-kernel
Subject:    [patch 03/30] bonding: fix multiple module load problem
From:       Greg KH <gregkh () suse ! de>
Date:       2009-06-30 23:59:47
Message-ID: 20090701000356.613902877 () mini ! kroah ! org
[Download RAW message or body]

2.6.27-stable review patch.  If anyone has any objections, please let us know.

------------------

From: Stephen Hemminger <shemminger@vyatta.com>

[ Upstream commit 130aa61a77b8518f1ea618e1b7d214d60b405f10 ]

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>

---
 drivers/net/bonding/bond_sysfs.c |    1 +
 1 file changed, 1 insertion(+)

--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1464,6 +1464,7 @@ int bond_create_sysfs(void)
 			printk(KERN_ERR
 			       "network device named %s already exists in sysfs",
 			       class_attr_bonding_masters.attr.name);
+		ret = 0;
 	}
 
 	return ret;


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