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List:       fop-user
Subject:    Re: FOP.91beta Spanning a page break
From:       Paul Dumais <paul () unstate ! ca>
Date:       2006-02-24 23:43:00
Message-ID: loom.20060225T000605-784 () post ! gmane ! org
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Hi Jeremias,

Thanks for the info. I tried inserting some docbook elements such as <?dbfo-need
height="2in" ?> and <?dbfo keep-together="auto" ?>. The first is supposed to put
in a page break if the "2in" condition is met (that is less than 2 inches remain
before the end of the page). The second element is supposed to relax the
keep-together property so that the procedure can be broken. Neither appear to
work for me. Should I take my problem to the docbook mailing list?

Here is the docbook 5.0 article (task/procedure) that I am trying to output to
pdf using fop .91beta:

<!--@+leo-ver=4-thin-->
<!--@+node:paul.20060217090820:@thin protocols/misc/test.xml-->
<!--@@color-->
<!--@@language html-->
<!--@@nowrap-->
<article xmlns="http://docbook.org/ns/docbook" version="5.0" xml:lang="en">
    <title>WaterJet Protocol</title>
    <!--@    << Task >>-->
    <!--@+node:paul.20060217093550:<< Task >>-->
    <task>
        <title>Drill or Cut Holes in Glass</title>
        <!--@    << Procedure >>-->
        <!--@+node:paul.20060217090820.2:<< Procedure >>-->
        <procedure>
            <step>
                <para>Presuming that you already have a file drawn in L-edit, 
                you will need to convert only the needed information from .tdb 
                format to .dxf format. At present, we have software that will do
                this conversion for holes only. There is also software in the 
                Nanofab that will convert a .gds file into a .dxf file. This 
                will work for both holes and polygons (for dicing lines).
                </para>
            </step>
            <step>
                <para>Save a copy of your L-edit design file with a new name. 
                You should have the holes and lines to be cut drawn on a 
                separate layer. Hide all layers except the one just mentioned 
                and the one that shows the outline of your wafer/substrate 
                (usually icon/outline). Move all the remaining objects so that 
                the origin of the coordinate system is at the lower left hand 
                corner of your substrate. Make sure that the mask that was made 
                from this L-Edit file was printed chrome side down. If it was 
                printed chrome side up, then your hole pattern will be a mirror 
                about the vertical center line with respect to the patterned 
                substrates. In this case, you will need to modify your drawing 
                by mirroring it about the same axis. Note that the WaterJet 
                software does not properly compensate for the actual hole 
                diameter that will be drilled due to factors such as abrasive 
                type, tube type, hole diameter, plate thicknesses and drill 
                speed. Therefore, the hole size specified in the .dxf file needs
                to be smaller than the desired size. This size reduction depends
                on the factors listed above and is so far a matter of experience
                and trial and error. For drilling a single 1.1mm borofloat glass
                plate bonded with a 0.5 mm 0211 glass plate, and a desired hole 
                diameter of 2 mm, medium abrasive, medium-low power/pressure 
                (and other factors that the operator finds suitable), the 
                specified diameter needs to be 1.1 or 1.15 mm. These parameters 
                should also hold for drilling similar holes in 1.1 mm borofloat 
                plates bonded together with 2mm thick plate glass. The above is 
                just for your information, always get the proper specification 
                from Herb Dexel prior to to drilling, and check the diameter 
                drilled on your first plate to make sure your first guess was 
                suitable, adjust as required.
              </para>
            </step>
            <step>
              <para>Select all the holes and change the radius to reflect the 
              needed reduction as given to you (see above).
              </para>
            </step>
            <step>
                <para>Select all objects (substrate outline, holes, cut lines) 
                and select cell...flatten from the L-edit menu. Save the 
                document. Select file...Export Mask Data...Cif and save the .cif
                file to a directory that you can easily find when you later use 
                the ssh client to transfer it to gaea (one of our Linux 
                servers).
                </para>
            </step>
            <step>
                <para>
                Open the ssh Secure Client Shell. Login to gaea. Navigate to: 
                /home/Archive/Software/Students/paul/WaterJet/Code. There are 
                two important files here: Cift and README. README contains the 
                simple instructions on how to operate the software. Cift is the 
                program that you run on gaea to convert the holes on your .cif 
                drawing to holes on specified in a .dxf drawing. Move your .cif 
                file to this directory (click on the new file transfer window 
                icon to open the secure file transfer client).
                </para>
            </step>
            <step>
                <para>
                In the SSH secure shell, type ./Cift . This will start a the 
                menu-driven program. Press 1, < Enter>. Type or paste in 
                the file name of the .cif file you want to convert. Press < 
                Enter>. Press < Enter> again. Press 3, < Enter>. 
                This will write your file to output.dxf. Press < Enter> 
                again. Press q, < Enter> to quit.
                </para>
            </step>
            <step>
                <para>
                Using the SSH Secure File Transfer client as before, move 
                output.dxf back to the directory that contains the original .cif
                file. Open the .dxf file in an appropriate editor (Rhinoceros 
                works). Make sure all the holes are there and make sure that the
                zero of your coordinate system is at the bottom left of the 
                substrate.
                </para>
            </step>
            <step>
                <para>
                In this same editor, draw in any linear cuts that need to be 
                made. Save the file and send a copy to the WaterJet operator via
                a 3.5" floppy.
                </para>
            </step>
            <step>
                <para>
                Using Crystalbond 590 (brown stick), bond one glass substrate to
                a sacrificial glass plate (usually cheap plate glass as thin as 
                possible ~2mm). In the case of borofloat where you want to bond 
                only the non-tin sides, make sure that you scribe the word 'Tin'
                on the side that is marked with a 'T' with permanent marker. Use
                a clean wipe and acetone to check which side of the glass this 
                'T' is written on. This 'T' should be removed and with acetone 
                after 'Tin' has been scribed onto the tin side with a diamond 
                scribe. Using a hot plate (preferably a digitally controlled 
                one) set the temperature to 150 degrees C. Place aluminum foil 
                onto the plate (so as not to dirty the hot plate) once this 
                temperature has been reached.
                </para>
            </step>
        </procedure>
        <!--@-node:paul.20060217090820.2:<< Procedure >>-->
        <!--@nl-->
    </task>
    <!--@nonl-->
    <!--@-node:paul.20060217093550:<< Task >>-->
    <!--@nl-->
</article>
<!--@nonl-->
<!--@-node:paul.20060217090820:@thin protocols/misc/test.xml-->
<!--@-leo-->

Thanks,

Paul






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